Published October 15, 2024

This teardown examines the internal design of the standard iPhone 16 and iPhone 16 Plus. The source states that the standard models are a better purchase than the Pro series, provided the buyer prioritizes a high refresh rate. The analysis covers the structure, components, repairability, performance, and thermal behavior of both models, with comparisons to the iPhone 16 Pro series.

Disassembly Procedure

Step 1: SIM Tray

• The device is powered off before the SIM tray is removed.
• The tray supports dual SIM cards, stacked vertically.
• The tray is machined from a single block of aluminum alloy using CNC processing.
• A dust- and water-resistant rubber ring is fitted on the inside of the tray.
• Due to internal layout changes, the SIM tray is placed horizontally, which is uncommon.

Step 2: Display

• The two pentalobe screws at the bottom are removed.
• The bottom edge is heated, and a blade is inserted to lift a gap.
• A spudger and isopropyl alcohol are used to cut the adhesive around the perimeter.
• The display is opened from right to left.
• Two flex cables connect the display to the logic board. The upper cable is a sensor cable under 3 mm wide and must not be torn.
• After the screws and shield are removed, the connectors are separated.

Display components:

• Suppliers: Samsung and LG. The source reports that BOE was added to the supplier list this year.
• Cover glass: New-generation Ceramic Shield, the same as the iPhone 16 Pro series. Hardness is 50% higher than the first generation.
• Specifications: Size, resolution, refresh rate, and dimming method are unchanged from the previous generation.
• Brightness: The source describes the brightness of the two displays as comparable.
• Rear structure: A full metal back plate. The display is secured by metal clips on the bracket that fit into the inner frame, with waterproof adhesive sealing the perimeter.

Face ID module and ambient light sensor:

• A metal cover and screws secure the Face ID module below the display.
• The ambient light sensor is integrated into the display flex cable.
• Without a periscope telephoto module, the ambient light sensor returns to its position below the Face ID module.

Differences from the Pro series:

• The hidden plastic bracket changes from translucent to black.
• The heat-dissipation film at the connector area is smaller. Only a small section over the sensor connector remains.
• The display connector heat film is replaced by a black insulating sheet.
• The display driver board uses metal packaging. The packaging protects the display driver IC (DDIC) and provides supplementary heat dissipation.
• The DDIC position indicates that the Pro series has a narrower chin.
• All ICs on the driver board are custom-designed. Apple did not disclose any usable information about them.

Body heat management:

• A large heat-dissipation film covers the body. It works with a full aluminum midframe to spread heat.
• Coverage is smaller than on the Pro series. The Pro series film covers the rear camera, the logic board's main heat zone, and the battery area.
• The standard models' film avoids the rear camera area. The source states that no obstruction exists in that area and questions the reason for the exclusion.
• A black insulating sticker remains on the lower edge of the body.

Step 3: Rear Cover

• The rear cover is removed using the same method as the display: heat, blade, adhesive cutting, and opening.
• Care is required to avoid pulling or cutting the wireless charging flex cable.
• Two screws are removed, and the cover is detached.
• The battery connector is disconnected first to cut power.
• The wireless charging flex cable is then detached to release the rear cover.

Rear cover characteristics:

• The cover is glass.
• The design changes from the Pro series, but the cold-engraved camera bump finish is retained.
• Sapphire glass lenses still produce ghosting. The source reports that Apple removed the anti-reflective lens coating description from its official website several days after launch.

Internal structure:

• The internal layout is similar to the Pro series, but the heat-dissipation film covers less area.
• The reduction is concentrated around the wireless charging coil, which uses a black insulating sheet instead of heat film.
• A metal reinforcement plate remains under the film. Except for the secondary board area, the plate covers nearly the entire rear cover.
• The large metal reinforcement plate improves impact resistance and expands the heat-dissipation area together with the film.
• The source states that the wireless charging coil's frequency does not comply with national regulations, so its power is limited.

Small components:

• Foam around the two rear cameras prevents dust intrusion.
• Two conductive cloth strips for electrostatic protection are attached to the right side of the main camera.
• The rear cover is attached to the midframe with metal clips along its edges and adhesive, the same method used for the display.
• The wireless charging flex cable integrates the rear microphone and the True Tone flash.

Microphone and flash differences:

• The standard models do not use a studio-grade microphone. The source attributes the difference to the microphone's size.
• The standard models' True Tone flash adjusts only brightness. It lacks the beam-angle adjustment of the Pro series' adaptive True Tone flash.
• Removing the flash lens reveals that the Pro series flash LEDs are larger and divided into nine segments. This segmentation enables fine beam-angle control.

Step 4: Logic Board

Overall layout:

• The source describes the Plus as an enlarged version of the iPhone 16.
• Rear cameras, Face ID, and logic board specifications are identical between the two standard models.
• The main difference is the volume of the upper and lower speaker chambers.
• To improve overall heat dissipation, Apple abandoned the side-mounted logic board layout it had used for more than a decade. The system-on-chip (SoC) was moved closer to the center of the device, distributing heat more evenly across the body.
• The SoC was moved to the upper-left of the board. This allowed the lower-right area to be designed narrower, freeing space for the battery.
• The horizontal SIM tray placement results from this layout change.
• The camera control button occupies the position previously used by the millimeter-wave antenna. The antenna moved to the top speaker. The China-market version does not use this antenna, so Apple placed a small plastic filler at this position.

Removing the logic board:

• Four screws are removed, and the connector cover is taken off.
• All connectors on the board are detached.
• The Face ID module is removed. From left to right, it consists of the dot projector, proximity sensor, infrared camera, and front camera.
• Compared with the Pro series, the cable style and packaging of the Face ID module are modified. Component specifications and layout are unchanged.

Top speaker:

• All screws securing the top speaker are removed, and the speaker is taken out.
• An LCP antenna is fixed to the upper-right corner of the speaker.
• A dust- and water-resistant gasket is added inside the speaker outlet.
• The speaker chamber projection is larger than on the Pro series.

Logic board structure:

• The board uses a traditional two-layer stacked design.
• A black insulating sticker is placed near the battery.
• Both standard models use a "7"-shaped board with identical board shapes. The model is identified by a resistor.
• The shield over the main heat zone is covered with heat film printed with an Apple logo. A second Apple logo is printed on a PCB corner.
• All connectors are surrounded by buffer foam.
• After the small components are removed, their pads are sealed with adhesive.
• The millimeter-wave antenna connector is unused. A plastic piece fills the gap and protects the solder pads.
• The midframe area corresponding to the logic board has heat film for heat conduction. No thermal filler fills the gap.
• The iPhone 16 layout is identical to the Plus.

Memory and processors:

• The board is separated using a hot-air gun, and the thermal compound is removed.
• Micron 8 GB LPDDR5X RAM is stacked with the A18 chip in a package-on-package (PoP) configuration.
• The A18 internal code is APL1V08. The chip is marked only with the Apple logo, without an SoC model number.
• A power management IC designed by Apple is located on the right.
• The A18 is sandwiched between two board layers. The baseband chip faces the A18 directly.
• A metal strip attached beside the baseband chip increases structural strength and conducts heat from the SoC, improving heat transfer.
• The Pro series has a similar empty space but no equivalent design.
• On the back, the ROM partly overlaps the A18.
• The ROM is from Toshiba (Kioxia) and uses the NVMe protocol.

Wireless and connectivity components:

• The U2 ultra-wideband chip is next to the ROM.
• The USI-packaged Wi-Fi/Bluetooth module uses a Broadcom solution.
• The module supports Wi-Fi 7 and Bluetooth 5.3.
• The iPhone 16 series does not support the 320 MHz channel bandwidth that Wi-Fi 7 allows. It is limited to 160 MHz.
• The series also does not support 4K QAM.

Other external components:

• The external baseband chip is the Qualcomm X71, as on the Pro series.
• Two Qualcomm SDR735 RF ICs are used.
• The PCB is manufactured by Unimicron.
• The projected area of the logic board is slightly smaller than that of the Pro series.
• Chips are distributed on both sides of the board.

Performance and Thermal Testing

Gaming:

• The source tested Honkai: Star Rail for 30 minutes under identical settings.
• The A18 has one fewer GPU core than the A18 Pro.
• The source reports no decrease in actual gaming experience.
• The average frame rate of both standard models exceeds that of the iPhone 16 Pro.

Power consumption:

• Total system power draw is higher on the iPhone 16 than on the Pro.
• The iPhone 16 Plus draws less power than the Pro Max.

Thermal performance:

• The aluminum frame and the centrally placed SoC improve temperature control compared with the Pro series.
• Thermal imaging shows that the heat source is more centered, which distributes SoC heat more evenly.

Step 5: Rear Cameras

• All screws securing the rear cameras are removed, and the camera assembly is taken out.
• Both cameras are fixed in a metal anti-roll frame.
• Cut marks on the frame show that it is CNC-machined.
• The source states that the metal strength of the frame is higher than the powder-metallurgy anti-roll frames common in Android devices.

Sensors:

• All image sensors are from Sony.
• The main camera CMOS is one size smaller than the Pro series' CMOS.
• The ultra-wide CMOS is the same size as the Pro series' ultra-wide sensor, but its model and pixel count differ.
• The front camera uses an identical lens.
• Foam buffers protect the lenses where they contact the midframe.

Step 6: Vibration Motors

• All screws securing the motors are removed, and the X-axis linear motor is taken out.
• The Plus and Pro Max motors are identical in size.
• The iPhone 16 motor is slightly larger than the Pro motor.
• The source states that the iPhone 16 motor exceeds the size of the CSA0916, the largest Android motor the source cites.
• iPhone motors use a board-to-board (BTB) connector with more pins than the contacts typical of conventional motors.
• Each motor has a Hall sensor that monitors the position of the vibrating mass in real time, enabling more precise control.

Step 7: SIM Card Slot

• All screws securing the SIM slot module are removed, and the module is taken out.
• The SIM slot is a standalone modular design. The source states that this design benefits repair and simplifies conversion for US-version SIM use.

Step 8: Speakers

• All screws securing the bottom speaker are removed, and the speaker is taken out.
• The bottom speaker chamber projection is larger than on the Pro series.
• Both the top and bottom speakers include acoustic enhancement material.
• The material is white powder inside the speaker. The source states that it is not an explosive, as some online reports claim. Its function is to improve low-frequency response.

Step 9: Bottom Microphone Module and USB-C Port

• The connector is pried open.
• All screws securing the bottom microphone module are removed, and the module is taken out.
• The metal cover above the module is separated.
• Three holes on the module are, from left to right: the barometric pressure sensor vent, the microphone sound hole, and the pressure equalization hole.
• Inside the module are the barometric pressure sensor, the bottom microphone, and a white waterproof breathable membrane.
• All screws securing the tail connector flex cable are removed. The cable is removed after heating.
• The flex cable integrates a second bottom microphone and a USB 2.0 Type-C port.
• The port's plastic housing is pink, similar in color to the frame. Waterproof adhesive is applied to the inside.
• The port's tongue has a full-pin design. The source states that this allows the USB 2.0 port to support DisplayPort video output up to 4K HDR, which is uncommon for USB 2.0 ports. The source notes that last year's standard models also supported this feature.
• All pins are plated with an inert metal to improve oxidation and corrosion resistance.

Sealing and protection:

• A foam ring surrounds the microphone module on the bottom edge.
• The bottom speaker outlet has an orange waterproof ring.
• Metal dust meshes protect the internal openings.
• The sound hole of the second bottom microphone is covered by a white waterproof breathable membrane.
• The device has the same IP68 rating as the Pro series. It can withstand submersion at up to 6 meters for 30 minutes.

Step 10: Battery

Removal method:

• The iPhone 16 series uses a new battery adhesive.
• A metal tab is positioned at the lower-left corner of the battery.
• Applying electrical current softens the adhesive so the battery can be removed quickly.
• Procedure:
  1. A screw is installed on the midframe to connect the negative terminal.
  2. The metal tab is exposed.
  3. A regulated DC power supply is set to 30 V.
  4. The positive lead is connected to the tab, and the negative lead to the midframe.
  5. The circuit draws a current below 0.01 A.
  6. After approximately 30 seconds, the battery can be removed.
• The adhesive remains on the back of the battery with only slight tack.
• Because the power draw is very low, the adhesive does not heat up. The source states that the adhesive does not lose its bond through temperature change.
• For user replacement, the source recommends a 9 V battery and battery clip. After connection, the battery can be removed after approximately 90 seconds.
• The source notes that older pull-tab adhesives age with use and can tear easily, which makes removal difficult. It states that the new adhesive resolves this problem and is easier for inexperienced users.

Specifications:

• Both models use a single cell with a single connector.
• The manufacturer is Simplo Technology (新普科技).
• Energy density is calculated from the packaging dimensions.
• The iPhone 16 Plus density matches that of the iPhone 16 Pro Max.
• The iPhone 16 Pro has the highest density in the series, due to its metal-encased battery.

Cell structure:

• The pouch film is carefully cut to expose the cell.
• Metal plates cover both faces of the cell. They provide heat dissipation and structural support and protect against external impact.
• The metal plates are also connected to the electrodes.
• The cell's edge shows a laminated structure. Positive electrodes, negative electrodes, and separators are stacked in layers.

Step 11: Camera Control Button

• The removal method and internal structure of the camera control button are identical to those of the Pro series. The source does not repeat the procedure.
• The button is attached to the frame by laser welding.
• After the weld points are ground down, the metal backing plate separates from the key cap.
• The button body is removed.
• Inside is the Analog Devices AD7149 touch IC, as on the Pro series.

Step 12: Top Microphone and Antenna Cable

• All screws securing the upper-left antenna are removed, and the antenna cable is taken out.
• The top microphone is integrated into the cable and receives sound through the earpiece opening.
• The device has four microphones in total.
• The source states that the microphones are not large studio-grade units like those in the Pro series. However, the count exceeds that of most Android flagships.
• The microphones support wind noise reduction and audio mixing.

Build Summary

• All covers are metal.
• Foam buffers and conductive metal foam are installed inside the covers.
• Small components on the flex cables are sealed.
• The midframe assembly uses nano-injection molding combined with CNC machining in a single piece.
• The outer and inner frames are aluminum alloy.
• The battery adhesive area has its anodized layer removed to allow current to flow during removal.
• The standard models' heat-dissipation film extends further under the battery than the Pro series' film.

Conclusion

The source identifies several trade-offs in the standard models, which differentiate them from the Pro series:

• Refresh rate: The 60 Hz display is identified as the most significant drawback.
• Display bezels: The bezels are wider and more noticeable.
• Camera: The standard models use a smaller main sensor, different flash specifications, and no periscope telephoto lens or LiDAR scanner.
• Data transfer: The interface speed drops from 10 Gbps to 480 Mbps. The source notes that DisplayPort video output at 4K is retained.
• Heat dissipation: The heat-dissipation film covers a smaller area than on the Pro series. The source states that the centrally placed SoC and aluminum frame offset this disadvantage in temperature performance.